The Raspberry Pi Camera Module 3 Sensor Assembly SA36NA30P 11.9MP 2.75mm Wide NoIR Lens offers the advanced imaging technology of the Camera Module 3 in a standalone format, enabling OEMs to integrate high-quality camera capabilities into a broader range of custom designs. It features a 11.9-megapixel Sony IMX708 image sensor with key technologies such as 2D Dynamic Defect Pixel Correction (DPC), Phase Detection Autofocus (PDAF), QBC re-mosaic function, and High Dynamic Range (HDR) support for superior image quality. This model includes a powered autofocus lens with a wide 120° field of view and infrared sensitivity, making it well-suited for applications requiring low-light or night vision performance, such as robotics, surveillance, and embedded vision systems. Note: Refer to User Manual and Schematic Diagram in the ATTACHMENTS section for more info. regd. the product. Features: Advanced Autofocus System : Powered autofocus for fast and accurate focus adjustments Phase Detection Autofocus (PDAF) : Enables quick and reliable focus tracking, even on moving subjects 2D Dynamic Defect Pixel Correction (DPC): Enhances image quality by correcting defective pixels dynamically QBC Re-Mosaic Function: Improves low-light performance and image clarity High Dynamic Range (HDR) Support : Captures scenes with both bright and dark areas more effectively Lens Options: wide-angle (120°) autofocus lens Available in NoIR (Infrared Sensitive) Package Includes: 1 x Raspberry Pi Camera Module 3 Sensor Assembly SA36NA30P 11.9MP 2.75mm Wide NoIR Lens
Specifications
| FOV | 120° lens, NoIR (Infrared Sensitive) |
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| Sensor | SONY IMX708 |
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| Focus | Autofocus |
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| Visibility | Infrared Sensitive |
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| Viewing Angle (Deg.) | 120º |
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| Shipping Weight | 0.035 kg |
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