The Boson+ thermal camera module from Teledyne FLIR delivers high-performance longwave infrared (LWIR) imaging in an ultra-compact form factor. Designed for OEM integration, it combines excellent thermal sensitivity (≤20 mK), low latency, and enhanced image processing for sharp, high-contrast visuals. With its lightweight design and multiple interface options (USB, CMOS, MIPI), Boson+ is ideal for drones, robotics, handheld devices, surveillance systems, and industrial monitoring. The improved AGC and DDE+ image enhancement technologies ensure better clarity and detection even in challenging environments. Features: Ultra-high thermal sensitivity (≤20 mK) for precise detection Compact and lightweight (just 7.5g) optimized for SWaP applications Advanced image processing with AGC and DDE+ for better contrast Multiple video output options: USB, MIPI, CMOS Low latency performance for tracking and real-time decision-making Wide operating temperature range (-40°C to 80°C) NDAA compliant and ITAR-free for easier global deployment Specifications: Lens: 18mm (narrow field of view) HFOV: ~6°–12° (configuration dependent) Digital Zoom: 1x to 8x Power Input: 3.3V DC Power Consumption: ~600 mW (min) Interfaces: UART, I2C, USB, SPI, MIPI, CMOS Operating Temp: -40°C to 80°C Non-operating Temp: -50°C to 85°C Size: 21 × 21 × 11 mm (without lens) Weight: 7.5g (without lens) Package Includes: 1 x Teledyne FLIR Boson+ 22320A012-6PAAX Thermal Camera Module, 320×256 LWIR, 12° HFOV, 18mm Lens, <30mK, 60Hz OEM Core
Specifications
| Resolution | 320 × 256 pixels |
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| Thermal Sensitivity (NEdT) | ≤20 mK |
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| Frame Rate | Up to 60 Hz |
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| Pixel Pitch | 12 µm |
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| Spectral Range | 8 µm – 14 µm (LWIR) |
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| Shipping Weight | 0.020 kg |
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