Teledyne FLIR Boson+ 22640AS95-6PAAX Thermal Camera Module, 640×512 LWIR, 95° HFOV, 4.9mm Lens, <30mK, 60Hz OEM Core

The Boson+ 640 Thermal Camera Module is a high-performance longwave infrared (LWIR) imaging core designed for advanced OEM integration. Built for applications requiring precision and reliability, it delivers exceptional thermal sensitivity, improved contrast, and ultra-low latency. Its compact size and low power consumption make it ideal for drones, robotics, surveillance systems, and handheld thermal devices. With a 640×512 resolution and a wide 95° field of view, this module captures detailed thermal images even in challenging environments. Enhanced image processing features like advanced AGC and DDE+ ensure sharper visuals and better scene clarity, helping improve detection and tracking performance. Features: Ultra-high thermal sensitivity (≤20 mK) for superior image clarity Wide 95° HFOV with compact 4.9 mm lens Lightweight and compact design (just 7.5 g) Low latency output for real-time applications Flexible integration with USB, MIPI, and CMOS interfaces Advanced image processing with improved contrast and sharpness NDAA compliant and ITAR-free design Specifications: Pixel Pitch: 12 µm Field of View (HFOV): 95° Lens Type: 4.9 mm, f/1.0 Digital Zoom: 1x to 8x Input Voltage: 3.3 VDC Video Interfaces: CMOS, MIPI, USB Control Interfaces: UART, I2C, USB Operating Temperature: -40°C to 80°C Size: 21 × 21 × 11 mm (without lens) Weight: 7.5 g (without lens) Package Includes: 1 x Teledyne FLIR Boson+ 22640AS95-6PAAX Thermal Camera Module, 640×512 LWIR, 95° HFOV, 4.9mm Lens, <30mK, 60Hz OEM Core

Specifications

Resolution	640 × 512 pixels
Thermal Sensitivity (NEdT)	≤20 mK
Frame Rate	60Hz (30Hz selectable)
Spectral Range	8 µm – 14 µm (LWIR)
Power Consumption	Starting from ~1000 mW
Shipping Weight	0.015 kg
Shipping Dimensions	5 × 5 × 2 cm